Seminar 42 Power and Cooling Considerations for Back of Rack Ecosystems within the Data Center

Tuesday, January 31, 2017: 9:45 AM-11:00 AM
Mission Critical Design and Operation
Chair: Nick Gangemi, Northern Air Systems
Technical Committee: 9.9 Mission Critical Facilities, Data Centers, Technology Spaces and Electronic Equipment
IT equipment power and cooling trends continue to push the limits in the industry, primarily due to packaging density, high performance computing, and mass scale out deployment. The challenges associated with supporting these increasing trends is further exacerbated with the additional pain points of deploying the associated ‘Back of Rack Ecosystems”, i.e. power and networking solutions. This seminar presents the existing challenges in deploying rack level infrastructure solutions, and the associated best practices and considerations that must be implemented.

1  Rack Level Power Solutions and Its Associated Challenges and Deployment Best Practices

Jon Fitch, Ph.D., Dell Inc
In 2016, ASHRAE published a whitepaper entitled ‘Data Center Power Equipment Thermal Guidelines and Best Practices’. This whitepaper paper discusses how changes to the data center thermal environment affects power distribution equipment. This session will not only highlight key takeaways from this paper, but extend the discussion to current examples and their associated challenges.

2  Top of Rack Networking Solutions and Its Associated Challenges and Deployment Best Practices

Dave Moss, Dell Inc.
In 2016, ASHRAE Released a brand new Datacom book, entitled ‘IT Equipment Design Impact on Data Center Solutions’. While this book highlights different IT solutions and its supporting networking infrastructure, it does not highlight the prevalence of non-optimal networking solutions and the resulting implications to the data center as a whole. This session not only highlights existing and emerging technologies and their associated best practice considerations, but also focuses on real world solutions and the resulting implications to capacity planning and industry efficiency objectives.

3  IT Equipment Exhaust-Side Deployment Challenges and Considerations

Dustin Demetriou, Ph.D., IBM
As the electronics industry continues to push the compute performance objectives of Information Technology Equipment by deploying new technologies, there exists the need to match these objectives with power and cooling best practices. This session discusses several new technologies, including non-volatile memory, active optical connectors and graphical processing units and the challenges of deploying these new technologies within server solutions. The session also highlights how these new technologies are approaching the limits of existing rack and room level cooling solutions

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