Shipping-container size enclosures now often house modular substations and data centers promising higher quality, lower risk, and better scalability than their stick-built counterparts. The electrical or electronics equipment housed in such enclosures may lack fans or be more like IT equipment of traditional data centers. Often a spatially-detailed thermal analysis is required to ensure that air temperatures are adequately controlled throughout the entire enclosure. Such modular applications introduce several modeling challenges related to the type of equipment housed, the cooling systems employed, and the extreme environments in which they must be designed to operate.
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